# US 7,071,078 B2 · Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

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- Number: US 7,071,078 B2
- Document ID: US7071078B2
- Status: Granted
- Kind: B2
- Application number: 10/933,889
- Filed: 2004-09-02
- Published: 2005-02-10
- Granted: 2006-07-04
- Earliest claimed: 2000-05-19
- Assignees: Micron Technology, Inc.
- Inventors: W. Jeff Reeder; Tongbi Jiang
- Web page: https://patentgrep.com/patent/US7071078B2

## CPC

- H05K 3/305: {Affixing by adhesive}
- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- H10W 40/251: {Organics}
- H10W 70/417: {Bonding materials between chips and die pads}
- H10W 72/0711: {Apparatus therefor}
- H10W 90/00: Package configurations
- H01R 4/04: using electrically conductive adhesives
- H05K 3/0058: {Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)}
- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
- H10W 70/415: {Leadframe inner leads serving as die pads}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/075: {of bond wires}
- H10W 72/354: {comprising polymers}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/551: {Materials of bond wires}
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/951: {Materials of bond pads}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the curable component of the hybrid adhesive material may be cured to more permanently secure the semiconductor device components to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200° C. and as low as about 120° C. or less.

## Claims

### Claim 1

A method for securing at least two semiconductor device components to one another, comprising:
applying an adhesive material comprising a pressure sensitive component and a curable component to at least a portion of a surface of a first semiconductor device component;
placing a surface of a second semiconductor device component in contact with the adhesive material to temporarily secure the second semiconductor device component to the first semiconductor device component; and
curing the curable component of the adhesive material.

### Claim 2 (depends on 1)

The method of claim 1, wherein placing comprises pressing the surface of the second semiconductor device component against the adhesive material.

### Claim 3 (depends on 1)

The method of claim 1, wherein, in placing the surface of the second semiconductor device component in contact with the adhesive material, the pressure sensitive component of the adhesive material temporarily secures the second semiconductor device component to the first semiconductor device component.

### Claim 4 (depends on 1)

The method of claim 1, wherein applying comprises applying the adhesive material to a carrier.

### Claim 5 (depends on 4)

The method of claim 4, wherein applying comprises applying the adhesive material to at least a portion of a surface of at least one of a lead frame, a circuit board, an interposer, and at least one semiconductor die.

### Claim 6 (depends on 1)

The method of claim 1, wherein placing comprises placing at least one semiconductor die in contact with the adhesive material.

### Claim 7 (depends on 1)

The method of claim 1, wherein placing comprises placing a heat sink in contact with the adhesive material.

### Claim 8 (depends on 1)

The method of claim 1, wherein applying comprises at least one of spraying the adhesive material, spreading the adhesive material, metered-dispensing of the adhesive material, extruding the adhesive material, contact applying the adhesive material, and positioning a structure coated with the adhesive material.

### Claim 9 (depends on 8)

The method of claim 8, wherein spraying comprises atomizing the adhesive material.

### Claim 10 (depends on 1)

The method of claim 1, wherein applying comprises spreading the adhesive material over only a portion of the surface of the first semiconductor device component.

### Claim 11 (depends on 1)

The method of claim 1, wherein applying comprises applying a film including the adhesive material on at least portions of opposite surfaces thereof to at least the surface of the first semiconductor device component.

### Claim 12 (depends on 1)

The method of claim 1, wherein curing the curable component of the adhesive material comprises heating at least the adhesive material.

### Claim 13 (depends on 12)

The method of claim 12, wherein heating comprises heating at least the adhesive material to a temperature of less than about 200° C.

### Claim 14 (depends on 12)

The method of claim 12, wherein heating comprises heating at least the adhesive material to a temperature of about 120° C.

### Claim 15 (depends on 1)

The method of claim 1, further comprising:
repositioning the first and second semiconductor device components relative to one another before curing the curable component of the adhesive material.

### Claim 16

A method for securing at least two semiconductor device components to one another, comprising:
applying an adhesive material comprising a pressure sensitive component and a curable component to at least one of the at least two semiconductor device components;
positioning the at least two semiconductor device components adjacent to one another with adhesive material positioned therebetween to at least temporarily secure the at least two semiconductor device components to one another; and
altering a state of the curable component of the adhesive material to permanently secure the at least two semiconductor device components to one another.

### Claim 17 (depends on 16)

The method of claim 16, wherein, during positioning, the pressure sensitive component of the adhesive material temporarily secures the at least two semiconductor device components to one another.

### Claim 18 (depends on 16)

The method of claim 16, wherein, during altering, the curable component of the adhesive material permanently secures the at least two semiconductor device components to one another.

### Claim 19 (depends on 16)

The method of claim 16, wherein positioning comprises pressing at least one of the at least two semiconductor device components toward the other of the at least two semiconductor device components.

### Claim 20 (depends on 16)

The method of claim 16, wherein applying comprises applying the adhesive material to a semiconductor device component that comprises a carrier.

### Claim 21 (depends on 20)

The method of claim 20, wherein applying the adhesive material to a semiconductor device component that comprises a carrier includes applying the adhesive material to one of a lead frame, a circuit board, an interposer, and at least one semiconductor die.

### Claim 22 (depends on 16)

The method of claim 16, wherein positioning comprises positioning a carrier adjacent to another semiconductor device component.

### Claim 23 (depends on 16)

The method of claim 16, wherein positioning comprises positioning a heat sink adjacent to another semiconductor device component.

### Claim 24 (depends on 16)

The method of claim 16, wherein applying comprises at least one of spraying the adhesive material, spreading the adhesive material, metered-dispensing of the adhesive material, extruding the adhesive material, contact applying the adhesive material, and positioning a structure coated with the adhesive material.

### Claim 25 (depends on 24)

The method of claim 24, wherein spraying comprises atomizing the adhesive material.

### Claim 26 (depends on 16)

The method of claim 16, wherein applying comprises applying a film including the adhesive material on at least portions of opposite surfaces thereof to at least a portion of a surface of at least one of the at least two semiconductor device components.

### Claim 27 (depends on 16)

The method of claim 16, wherein altering comprises heating at least the curable component of the adhesive material.

### Claim 28 (depends on 27)

The method of claim 27, wherein heating comprises heating at least the curable component to a temperature of less than about 200° C.

### Claim 29 (depends on 27)

The method of claim 27, wherein heating comprises heating at least the thermoset component of the adhesive material to a temperature of about 120° C.

### Claim 30 (depends on 16)

The method of claim 16, further comprising:
repositioning the at least two semiconductor device components relative to one another before altering the state of the curable component.