Three-dimensional integrated CMOS-MEMS device and process for making the same

A method for fabricating an integrated structure including a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS, the method comprising the steps of:

• providing a MEMS substrate having a surface;
• forming the MEMS on the substrate, the MEMS having an anchor portion;
• depositing a first layer overlying the MEMS;
• attaching a carrier plate to the first layer;
• removing the MEMS substrate after said steps of depositing the first layer and attaching the carrier plate, thereby exposing an underside of the MEMS;
• forming a conducting pad on the underside of the MEMS;
• and
• attaching the chip to the anchor portion of the MEMS, so as to make a conductive path from the chip to the MEMS through the conducting pad in a direction normal to said surface.

A method for fabricating an integrated structure including a first chip and a second chip, the method comprising the steps of:

• forming the first chip on a surface of a substrate;
• depositing a first layer overlying the first chip;
• attaching a carrier plate to the first layer;
• removing the substrate, thereby exposing an underside of the first chip;
• forming a conducting pad on the underside of the first chip;
• forming the second chip;
• and
• attaching the first chip to the second chip, so as to make a conductive path from the second chip to the first chip through the conducting pad in a direction normal to the underside of the first chip.