Ball grid array package having improved reliability and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorJeong-Woo Seo
Life of this patent
Estimating the term…
Abstract
A ball grid array package utilizing a layer of an elastic insulating material to protect conductive ball lands from deformation during subsequent processing and use of the resulting device and a method of manufacturing the same are disclosed. The elastic insulating layer preferably has a modulus of elasticity no greater than about 20 MPa or less to absorb and or distribute mechanical stress applied to conductive ball lands directly or through solder ball joints or other structures and thereby improve the solder joint reliability (SJR) of the resulting device.
Claims20
A ball grid array package comprising:
- a substrate;
- a plurality of conductive ball lands formed on a top surface of the substrate;
- an elastic insulating layer formed on an upper surface of the conductive ball lands;
- and
- a plurality of solder balls formed on a bottom surface of the substrate, the solder balls being electrically connected to corresponding conductive ball lands through openings extending through the substrate.
A method of manufacturing a ball grid array package comprising:
- preparing a substrate;
- forming conductive ball lands on a top surface of the substrate;
- forming an elastic insulating layer on a first group of the conductive ball lands;
- forming openings through the substrate to a lower surface of the conductive ball lands;
- and
- forming solder balls on a bottom surface of the substrate, the solder balls being electrically connected to corresponding conductive ball lands through the openings.
A method of manufacturing a ball grid array package, comprising:
- preparing a substrate;
- forming bond fingers and conductive ball lands on a top surface of the substrate;
- forming an elastic insulating layer on a first group of the conductive ball lands;
- mounting a semiconductor chip on a predetermined region of the substrate;
- forming connection members between bonding pads of the semiconductor chip and corresponding bond fingers;
- forming openings through the substrate to expose portions of a lower surface of the conductive ball lands;
- encapsulating the semiconductor chip, the bond fingers, the conductive ball lands and the connection members with a mold resin;
- and
- forming solder balls on the bottom surface of the substrate, the solder balls being electrically connected to corresponding conductive ball lands through the openings.
Dependencies are inferred from the claim text.