Production method for making film carrier tape for mounting electronic devices thereon
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorAkira Fujimoto
Life of this patent
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Abstract
A film carrier tape for mounting electronic devices thereon has a tin-bismuth alloy deposit in which the bismuth content in the deposit is substantially uniform along a thickness direction thereof. The film carrier tape can be produced by plating at least a part of a wiring pattern with a tin-bismuth alloy and washing the tin-bismuth alloy deposit formed by plating with a water-ejecting washing nozzle within 6 seconds after the plating is completed. A plating apparatus for use in the above production includes a washing nozzle for washing the film carrier tape within 6 seconds after the film carrier tape has exited a plating tank.
Claims4
A production method of a film carrier tape for mounting electronic devices thereon which comprises:
- plating at least a part of a wiring pattern formed on an insulating film with a tin-bismuth alloy plating solution in a plating tank, with the insulating film being stood up with one edge down;
- ejection washing the portion of the wiring pattern plated with the tin-bismuth alloy to remove the plating solution from the wiring pattern within 6 seconds after the stood-up film carrier tape exits the plating tank through a slit outlet opening by ejecting water from a washing nozzle;
- and subsequently
- moving the film carrier tape to a washing tank to further wash the film carrier tape.
Dependencies are inferred from the claim text.