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AssigneeTexas Instruments Incorporated
InventorsGonzalo Amador, Roger J. Stierman
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A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within the plurality. Immersed in a plating solution flowing in substantially laminar motion and at constant speed, the method creates periodic superposition of directions and speeds of the motion of the wafers and the motion of the plating solution. The invention creates periodically changing wafer portions where the directions and speeds are additive and where the directions and speeds are opposed and subtractive. Consequently, highly uniformly layers are electrolessly plated onto the exposed metallizations of bond pads. If the plated layers are bondable metals, the process transforms otherwise unbondable pad metallization into bondable pads.
A method of electroless plating of features on a semiconductor wafer, comprising the steps of:
A method of electroless plating of features on a semiconductor wafer, comprising the steps of:
A method of processing semiconductor wafers, comprising the steps of:
Dependencies are inferred from the claim text.