Sn-Zn lead-free solder alloy and soldered bond

Abstract

An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.

Dependencies are inferred from the claim text.