Method of laser processing and head for ejecting droplet
AssigneeSeiko Epson Corporation
InventorsDaisuke Sawaki, Masato Shimada, Kazushige Umetsu
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Abstract
A method of laser processing for processing a laminated member where a metal thin film is protruded from an end portion of a silicon substrate at the bottom of the silicon substrate, wherein; a laser beam of which wavelength has the light absorption coefficient of the metal thin film being higher than the light absorption coefficient of the silicon substrate, is irradiated onto an boundary between an end of the silicon substrate and the metal thin film so as to cut the metal thin film.
Claims16
A method of laser processing for processing a laminated member where a first material and a second material are laminated and the first material is protruded from the second material, wherein;
- a laser beam of which wavelength has the light absorption coefficient of the first material being higher than the light absorption coefficient of the second material, is irradiated onto an boundary area between the first material and an end of the second material.
Dependencies are inferred from the claim text.