Method for forming ceramic thick film element arrays

A method for forming thick film ceramic element arrays, the method comprising:

• providing a printing substrate having a release layer;
• applying a carrier coating to the release layer;
• forming ceramic elements on the carrier coating;
• providing a sintering substrate with a temporary adhesion layer;
• joining the printing substrate and the sintering substrate such that the ceramic elements are embedded in the temporary adhesion layer;
• initiating a phase change on the temporary adhesion layer;
• removing the printing substrate and the release layer such that the ceramic elements remain in the temporary adhesion layer;
• removing the temporary adhesion layer such that the ceramic elements remain on the sintering substrate;
• sintering the ceramic elements on the sintering substrate;
• depositing electrodes on the ceramic elements;
• and,
• transferring the ceramic elements to a target substrate.

A method of forming lead zirconate titanate (PZT) thick film ceramic element arrays, the method comprising:

• providing a printing substrate having a release layer;
• applying a vehicle layer to the release layer;
• forming PZT elements on the vehicle layer;
• providing a sintering substrate with a water layer;
• joining the printing substrate and the sintering substrate such that the PZT elements are wetted by the water layer;
• freezing the water layer;
• removing the printing substrate and the release layer such that the PZT elements remain in the frozen water layer;
• melting and drying the water layer such that the PZT elements remain on the sintering substrate;
• sintering the PZT elements on the sintering substrate;
• depositing electrodes on the PZT elements;
• and,
• transferring the PZT elements to a target substrate.