Method and apparatus for polishing substrates
AssigneeApplied Materials, Inc.
InventorsYongsik Moon, Kapila Wijekoon
Life of this patent
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Abstract
Method and apparatus for polishing substrates. A chemical mechanical polishing article comprises a body and a patterned surface. The patterned surface comprises a plurality of slurry distribution grooves and a plurality of islands on the body. Each of the plurality of the islands comprises a base portion, a polishing surface disposed thereon, and a contoured surface disposed therebetween. The base portion comprises one or more sidewalls defining at least a portion of the plurality of slurry distribution grooves. The polishing surface is smaller than the base portion, the difference therebetween attributable to the contoured surface. In a particular embodiment, conductive materials and low k dielectric films are polished with reduced or minimum substrate surface damage.
Claims13
A chemical mechanical polishing article, comprising:
- a body;
- and
- a patterned surface comprising a plurality of slurry distribution grooves and a plurality of islands on the body, each of the plurality of the islands comprising:
- an upper polishing surface;
- one or more sidewalls defining at least a portion of the plurality of slurry distribution grooves, wherein the sidewalls of each of the plurality of islands extend orthogonally from a floor of the plurality of grooves;
- and
- a contoured surface disposed between the upper polishing surface and the sidewalls.
A method of polishing materials disposed on a substrate, comprising:
- contacting a patterned surface of a chemical mechanical polishing article with material disposed on a substrate surface, wherein the patterned surface comprises a plurality of slurry distribution grooves and a plurality of the islands on the body, each of the plurality of the islands comprising:
- an upper polishing surface;
- one or more sidewalls defining at least a portion of the plurality of slurry distribution grooves, wherein the sidewalls of each of the plurality of islands extend orthogonally from a floor of the plurality of grooves;
- and
- a contoured surface disposed between the upper polishing surface and the sidewalls;
- and
- providing relative motion between the patterned surface and the substrate.
Dependencies are inferred from the claim text.