Process control in electrochemically assisted planarization
AssigneeApplied Materials, Inc.
InventorsAntoine P. Manens, Liang-Yuh Chen
Life of this patent
Estimating the term…
Abstract
Aspects of the invention generally provide a method for polishing a material layer using electrochemical deposition techniques, electrochemical dissolution techniques, polishing techniques, and/or combinations thereof. In one aspect of the invention, the polishing method comprises applying a separate electrical bias, such as a voltage, to each of a plurality of zones of an electrode. Determining the separate biases comprises determining a time that at least one portion of the material layer is associated with each of the zones of the counter-electrode.
Claims19
A processing system, comprising:
- a substrate holder;
- a pad support;
- a pad assembly disposed on the pad support, comprising:
- a first layer having a working surface adapted to contact a workpiece when retained in the substrate holder during processing;
- an intermediate layer coupled to the first layer;
- and
- a second layer coupled to the intermediate layer and having a plurality of independently electrically biasable zones;
- and
- a power delivery arrangement coupled to the pad support and configured to provide power to the zones of the second layer.
A processing system, comprising:
- a substrate holder;
- a first layer having a working surface adapted to contact a workpiece when retained in the substrate holder during processing;
- an intermediate layer coupled to the first layer;
- and
- a second layer coupled to the intermediate layer and having a plurality of independently electrically biasable zones, and the first, second, and intermediate layers comprising a unitary replaceable pad assembly;
- a pad support having the pad assembly removably coupled thereto;
- a polishing fluid delivery system adapted to deliver electrolyte to the working surface of the pad assembly and the second layer;
- and
- a power delivery arrangement coupled to the pad support for providing power to the zones of the second layer.
Dependencies are inferred from the claim text.