Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication

A substrate for mounting an IC chip

• being configured to be mounted, on a multilayered printed circuit board having an optical wave guide and
• comprising a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition,
• wherein
• at least one of light receiving element and a light emitting element is internalized or housed at a side of said substrate for mounting an IC chip, said side confronting said multilayered printed circuit board,
• such that;
• there is a space between said optical waveguide and said at least one of the light receiving element and the light emitting element;
• at least one of a light receiving part and a light emitting part is exposed;
• and
• a surface of said at least one of the light receiving part and the light emitting part is even with or projects from a surface of said substrate for mounting an IC chip.

A substrate for mounting an IC chip

• being configured to be mounted on a multilayered printed circuit board having an optical waveguide and
• comprising a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition,
• wherein:
• a side of said substrate for mounting an IC chip has at least one concave portion, said side confronting said multilayered printed circuit board;
• at least one of a light receiving element and a light emitting element is embedded in said at least one concave portion such that there is a space between said optical waveguide and said at least one of the light receiving element and the light emitting element, and a surface of at least one of a light receiving part of said light receiving element and a light emitting part of said light emitting element subsides below a surface of said substrate for mounting an IC chip;
• and
• an optical path connecting said light receiving part of said light receiving element to an optical signal and an optical path connecting said light emitting part of said light emitting element to the optical signal are secured.

A multilayered printed circuit board comprising a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition,

• wherein said multilayered printed circuit board has:
• a conductor circuit, configured to mount a substrate for mounting an IC chip, on an outermost interlaminar insulating layer;
• and
• an optical waveguide on an outermost interlaminar insulating layer at a side of said multilayered printed circuit board.

A multilayered printed circuit board comprising:

• a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetitions and a solder resist layer formed as an outermost layer, wherein;
• said multilayered printed circuit board has, on an outermost interlaminar insulating layer, a conductor circuit configured to mount a substrate for mounting an IC chip, and an organic optical waveguide;
• and
• a surface of said organic optical waveguide is exposed at a part of said solder resist layer.

A multilayered printed circuit board comprising a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition,

• wherein said multilayered printed circuit board further comprises:
• a conductor circuit, configured to mount a substrate for mounting an IC chip, on an outermost interlaminar insulating layer;
• and
• an organic optical waveguide having an under-cladding part, a core part, and an over-cladding part on an outermost interlaminar insulating layer at a side of said multilayered printed circuit board, and
• said over-cladding part covers whole region of said outermost interlaminar insulating layer.

A multilayered printed circuit board comprising:

• a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition;
• and an optical waveguide formed at outer side of said substrate,
• wherein said multilayered printed circuit board has:
• a conductor circuit, configured to mount a substrate for mounting an IC chip, on an outermost interlaminar insulating layer;
• and
• an elastic material layer comprising polyolefin resin and/or polyimide resin formed between said substrate and said optical waveguide.

A multilayered printed circuit board comprising:

• a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition;
• and an optical waveguide formed at outer side of the outermost interlaminar insulating layer,
• wherein said multilayered printed circuit board has:
• a conductor circuit, configured to mount a substrate for mounting an IC chip, on an outermost interlaminar insulating layer;
• and
• an elastic material layer comprising polyolefin resin and/or polyimide resin formed between said outermost interlaminar insulating layer and said optical waveguide.

A device for optical communication comprising:

• a substrate for mounting an IC chip;
• and a multilayered printed circuit board having an optical waveguide,
• wherein:
• at least one of a light receiving element and a light emitting element is mounted on a side of said substrate for mounting an IC chip such that there is a space between said optical waveguide and said at least one of the light receiving element and the light emitting element, and a light receiving part and a light emitting part are exposed, respectively, said side confronting said multilayered printed circuit board;
• said optical waveguide is formed on a side of said multilayered printed circuit board, said side confronting said substrate for mounting an IC chip;
• said substrate for mounting an IC chip and said multilayered printed circuit board are connected to each other by a solder connection part so as to transmit an electric signal;
• and
• said device for optical communication is constituted such that an optical signal can be transmitted through said optical waveguide, and said light receiving element or said light emitting element.

A device for optical communication comprising:

• a substrate for mounting an IC chip;
• and a multilayered printed circuit board having an optical waveguide
• wherein
• said substrate for mounting an IC chip is constituted so as to comprise a conductor circuit, an interlaminar insulating layer, and a via-hole connecting the conductor circuits with said interlaminar insulating layers interposed therebetween to each other,
• at least one of a light receiving element and a light emitting element is mounted on said substrate for mounting an IC chip,
• said substrate for mounting an IC chip is mounted on said multilayered printed circuit board through a solder bump for transmitting an electric signal, and
• there is a space between said optical waveguide and said at least one of the light receiving element and the light emitting element.