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US 7,069,790 B1Granted
Systems and methods for measuring relative thermal expansion coefficient of low thermal coefficient of expansion materials
AssigneeHoneywell International Inc.
InventorPaul W. Dwyer
Life of this patent
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Abstract
Systems and methods for accurately comparing the thermal expansion coefficient of components (materials substrate, etc.) to be attached in some manner. This invention utilizes the frequency output of a double-ended quartz resonator bonded to first and second reference components to generate waveforms when the components are subjected to a temperature change. The waveforms are compared to determine the thermal expansion compatibility of the components.
Claims12
A method comprising:
- attaching a double-ended tuning fork to a first reference material;
- attaching a second double-ended tuning fork to a second reference material;
- applying a pre-defined thermal test scenario to the first and second materials;
- recording output of the first and second double-ended tuning forks produced during the thermal test scenario;
- and
- determining a relative stress value between the first and second materials based on the recorded outputs of the first and second double-ended tuning forks.
3 more elements
An apparatus for comparing reference materials, the apparatus comprising:
- a first double-ended tuning fork attached to a first reference material for outputting a first vibration signal produced during a thermal test scenario;
- a second double-ended tuning fork attached to a second reference material for outputting a second vibration signal produced during the thermal test scenario;
- and
- a component configured to determine a relative stress value between the first and second reference materials based on the first and second vibration signals.
1 more element
An apparatus for comparing reference materials, the apparatus comprising:
- a first resonator attached to a first reference material for outputting a first vibration signal produced during a thermal test scenario;
- a second resonator attached to a second reference material for outputting a second vibration signal produced during the thermal test scenario;
- and
- a component configured to determine a relative stress value between the first and second reference materials based on the first and second vibration signals.
1 more element
Dependencies are inferred from the claim text.