# US 7,069,653 B2 · Method for electrically connecting a semiconductor component to an electrical subassembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,069,653 B2 - Document ID: US7069653B2 - Status: Granted - Kind: B2 - Application number: 10/343,873 - Filed: 2001-07-20 - Published: 2004-02-26 - Granted: 2006-07-04 - Earliest claimed: 2000-08-04 - Assignees: Robert Bosch GmbH - Inventors: Rainer Topp; Dirk Balszunat; Stephan Ernst; Achim Henkel; Doerte Eimers-Klose; Reinhard Milich - Web page: https://patentgrep.com/patent/US7069653B2 ## CPC - H10W 70/435: {of insulating layers on leadframes, e.g. bridging members} - H10W 40/10: Arrangements for heating - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 78/00: Detachable holders for supporting packaged chips in operation - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49121: Beam lead frame or beam lead device - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49147: Assembling terminal to base - Y10T 29/49156: with selective destruction of conductive paths - Y10T 29/49169: Assembling electrical component directly to terminal or elongated conductor - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g., a punched grid, which, even before being joined to the semiconductor component, has already been embedded on at least one side in at least one partial area in a material that is not electrically conductive, is used as the metal strip grid. This procedure is used for bond-free contacting of semiconductor components for high-power applications in which a power loss of more than 1 Watt may occur. ## Claims ### Claim 1 A method for establishing an electrical connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module comprising: providing a metal strip grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by at least two metal strip conductors; joining the semiconductor component and the metal strip grid, wherein the semiconductor component includes an unhoused semiconductor chip which has electric terminals formed by metallized contact areas, such that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends occurs; establishing an electrical connection between the electrical terminals of the semiconductor component and the internal terminal ends by the mounting; wherein the metal strip grid before being joined to the semiconductor component has been connected on at least one side in at least one partial area to a material that is not electrically conductive, wherein the metal strip grid includes a punched grid surrounded on both sides in at least part of the partial area by electrically nonconducting material, the electrically nonconducting material forming a contact frame that establishes the connection and fixation of the at least two metal strip conductors forming the conductors relative to one another; introducing a metallic body that functions as a heat sink into an electrically nonconducting housing; covering the semiconductor component on a bottom side with an electrically conductive bonding material; positioning the semiconductor component on the metallic body; covering one of the electric terminals on the top side of the semiconductor component and the internal terminal ends of the punched grid with one of the electrically conducting bonding material and another electrically conducting bonding material; positioning the punched grid to lie with the external terminal ends on terminal areas of the additional parts of the electric module at a same time; and mounting the external terminal ends to the terminal areas simultaneously. ### Claim 2 (depends on 1) The method according to claim 1, further comprising securing the semiconductor chip at a same time during the mounting so that the chip is protected from slippage by an inside edge of the conductive material. ### Claim 3 (depends on 1) The method according to claim 1, further comprising presecuring the punched grid during positioning by a nose element mounted on the metal strip grid of electrically nonconducting material to engage in an opening in the heat sink. ### Claim 4 (depends on 3) The method according to claim 3, wherein the nose element locks in the opening. ### Claim 5 A method for establishing an electrical connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module comprising: providing a metal strip grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by at least two metal strip conductor; joining the semiconductor component and the metal strip grid such that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends occurs; and establishing an electrical connection between the electrical terminals of the semiconductor component and the internal terminal ends by the mounting; wherein the metal strip grid before being joined to the semiconductor component has been connected on at least one side in at least one partial area to a material that is not electrically conductive, the electrically nonconducting material forming a contact frame that establishes the connection and fixation of the at least two metal strip conductors forming the conductors relative to one another, and wherein the semiconductor component includes an SMD component, the electric terminals including metallic contact legs of the SMD component, the metal strip grid embedded in part in an electrically nonconducting housing of the electric module. ### Claim 6 (depends on 5) The method according to claim 5, wherein the mounting includes first presecuring the SMD component by pressing the contact legs against the internal terminal ends, and wherein the method further comprises welding the contact legs. ### Claim 7 (depends on 5) The method according to claim 5, wherein the metal strip grid includes embossing on the internal terminal ends for slip-proof positioning of the contact legs. ### Claim 8 (depends on 1) The method according to claim 1 wherein the electrically nonconducting material of the metal strip grid includes a nonconducting layer of a substrate. ### Claim 9 (depends on 8) The method according to claim 8, wherein the substrate is flat. ### Claim 10 (depends on 8) The method according to claim 8, wherein the electrically nonconducting material includes a polymer layer. ### Claim 11 (depends on 10) The method according to claim 10, wherein the polymer layer includes part of an IMS substrate. ### Claim 12 (depends on 8) The method according to claim 8, wherein the slip-proof mounting of the semiconductor component includes a flip-chip technique. ### Claim 13 (depends on 11) The method according to claim 11, further comprising filling an interspace between the IMS substrate and the semiconductor component with a thermal conductor material after mounting the semiconductor component. ### Claim 14 (depends on 8) The method according to claim 8, further comprising installing the substrate and the semiconductor component mounted on the substrate in a housing.