Method for producing a circuit board
AssigneeNGK Insulators, Ltd.
InventorsTakahiro Ishikawa, Masahiro Kida, Shuhei Ishikawa, Nobuaki Nakayama
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Abstract
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
Claims17
A method for producing a circuit board having a metal circuit pattern on an insulating substrate, said method comprising the steps of:
- joining a metal plate onto a surface of said insulating substrate using a hard brazing member containing an active element;
- performing an etching treatment on said metal plate to form said metal circuit pattern from said metal plate, said etching treatment exposing a conductive reactive layer that is created by a reaction between said active element of said hard brazing member and said insulating substrate during said joining step;
- and
- removing a portion of said conductive reactive layer by a sandblast treatment to expose said surface of said insulating substrate adjacent said metal circuit pattern to thereby obtain said circuit board having said metal circuit pattern on said insulating substrate.
A method for producing a circuit board having a metal circuit pattern on an insulating substrate, said method comprising the steps of:
- performing a pressing treatment to form said metal circuit pattern from said metal plate;
- forming a bridge for connecting parts of said metal circuit pattern by half blanking said metal plate;
- joining said metal circuit pattern onto a surface of said insulating substrate using a hard brazing member containing an active element;
- cutting said bridge after said joining step;
- and
- removing a portion of a conductive reactive layer that is created by a reaction between said active element of said hard brazing member and said insulating substrate during said joining step by a sandblast treatment to expose said surface of said insulating substrate adjacent said metal circuit pattern to thereby obtain said circuit board having said metal circuit pattern on said insulating substrate.
Dependencies are inferred from the claim text.