Method for preparing composite materials of a positive temperature coefficient thermistor
AssigneeProtectronics Technology Corporation
InventorsRen-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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AssigneeProtectronics Technology Corporation
InventorsRen-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
Estimating the term…
The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal. Finally, a thermal-laminating process is performed to laminate a polymeric composite material on the composite electroplating layer to form the composite materials of the positive temperature coefficient thermistor device, wherein the polymeric composite material is conductive crystallized and filled with the carbon black.
A method for preparing composite materials of a positive temperature coefficient thermistor device, comprising the following steps:
Dependencies are inferred from the claim text.