US 7,069,102 B2Granted

System and method to customize bond programs compensating integrated circuit bonder variability

AssigneeTexas Instruments Incorporated

InventorsDavid J. Bon, Sreenivasan K. Koduri

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Abstract

A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.

Claims2

Dependent claims

A system comprising

a first bonder for bonding semiconductor chips having a calculating unit for manipulating data relating to a bonding operation, a memory unit for storing information relating to the bonding operation, and an optical unit for acquiring visual images relating to the bonding operation,
and a communication means for providing communication between the calculating unit, the memory unit, and the optical unit of a bonder, and for providing communication to a second bonder;
the second bonder having a calculating unit for manipulating data relating to a bonding operation, a memory unit for storing information relating to the bonding operation, and an optical unit for acquiring visual images relating to the bonding operation, an adaptive compensator for generating a corrected device program for controlling the bonding operation, and a communication means for providing communication between the calculating unit, the memory unit, and the optical unit of a bonder, and for providing communication to the first bonder;
a semiconductor chip having a plurality of bondpads arranged on the semiconductor chip;
a set of segments of bondpads of the semiconductor chip, each segment having a reference member related to a number of bondpads in the segment and coordinates of the reference member and a visual representation of the segment;
a device program including information related to the semiconductor chip and the segments, the reference members, the coordinates of the reference members, and the visual representations;
the device program stored in the memory unit of the first bonder and a copy of the device program stored in the second bonder;
corrective data generated in the calculating unit of the second bonder relating the device program related to the semiconductor chip and the segments, including the reference members, the coordinates of the reference members, and the visual representations;
the adaptive compensator of the second bonder adaptive to compare information from the stored device program and the corrective data ;
and
a bond program corrector for generating a corrected device program relating to the semiconductor chip and the segments, including the reference members, the coordinates of the reference members, and the visual representations, suitable for aiding the second bonder for the bonding operation.

8 more elements

A method for bonding a semiconductor chips with a plurality of bonders;

comprising
providing a first bonder having a calculating unit for manipulating data relating to a bonding operation, a memory unit for storing information relating to the bonding operation, an optical unit for acquiring visual images relating to the bonding operation and a
a communication means for providing communication between the calculating unit, the memory unit, and the optical unit of a bonder, and for providing communication to a second bonder;
providing the second bonder having a calculating unit for manipulating data relating to a bonding operation, a memory unit for storing information relating to the bonding operation, and an optical unit for acquiring visual images relating to the bonding operation, an adaptive compensator for generating a corrected device program for controlling the bonding operation, and a communication means for providing communication between the calculating unit, the memory unit, and the optical unit of a bonder, and for providing communication to the first bonder;
providing a semiconductor chip having a plurality of bondpads arranged on the semiconductor chip;
grouping the plurality of bondpads of the semiconductor chip into a plurality of segments, each segment having a reference member related to the bondpads in the segment, coordinates of the reference member and a visual representation of the segment;
generating a device program including information related to the displacement of the bondpads on the semiconductor chip and related to the segments that group the bondpads, the reference members, the coordinates of the reference members, and the visual representations;
storing the device program in the memory units of the first bonder and a copy of the device program in the second bonder;
placing a semiconductor chip of the device program on the second bonder having the device program;
capturing visual images of the segments of the bondpads on the semiconductor chip including the reference members and their coordinates;
communicating the visual images to the calculating unit;
communicating the device program to the calculating unit;
generating corrective data in the calculating unit of the second bonder based on the device program and the visual images;
the adaptive compensator comparing the stored device program and the corrective data generating a corrected device program in the bond program corrector relating to the semiconductor chip and the segments, including the reference member, new coordinates of the reference members, and the visual representations;
communicating the corrected device program to the control unit of the second bonder for controlling the bonding operation;
and
performing the bonding of the semiconductor chip based on the corrected device program.

14 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/855,893Filed 15 May 2001 · us provisional application
Priority: 16 May 2000
Published: US 2001/0044660 A122 Nov 2001
Granted: 27 Jun 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

G05B 19/4083
Characterised by data handling or data format, e.g. reading, buffering or conversion of data: adapting program, configuration
G05B 2219/36046
Nc in input of data, input key till input tape: adapt, modify program as function of configuration of machine
G05B 2219/36048
Nc in input of data, input key till input tape: verify, probe workpiece, if position deviation edit, modify program
G05B 2219/45033
Nc applications: wire bonding, wire wrap