Mold type semiconductor laser

A mold type semiconductor laser comprising:

• a die pad and a plurality of leads formed by a plate-shaped lead frame, the die pad being connected to one of the leads;
• a package that is made of mold resin, and integrally holds the die pad and the leads;
• a laser chip that is mounted on the die pad through a sub-mount;
• and
• a transparent plate that is placed in front of a light-outgoing face of the laser chip,
• wherein the package comprises at least an upper mold resin portion which, in the case when the lower face of the die pad and the leads serves as a parting line, covers the leads on the upper face side by the parting line;
• the upper mold resin has two frame side walls, which extend in a direction parallel to the laser-beam outgoing direction of the laser chip, and also extend ahead of the laser chip outgoing face on the two sides with the laser chip interposed therebetween;
• and each of the two frame side walls has a slit, which is used for placing the transparent plate on the two frame side walls not in a direction perpendicular to the outgoing direction of the laser beam, but with a predetermined angle for correcting astigmatism, and which is formed from the upper face side of the frame side walls through the lower face of the laser chip, and
• wherein the transparent plate is secured into two slits of the two frame side walls, and only in the upper mold resin portion.