Multiplex laser-light source and exposure system

A laser-light source comprising a plurality of laser-light-source portions each of which includes:

• a heat-dissipation block made of copper or copper alloy;
• a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/,C, have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
• a plurality of semiconductor lasers each of and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
• a multimode optical fiber;
• and
• an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
• which is made of a nitride compound, has a single cavity wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light-source portions is arranged to constitute a one-dimensional array at least at a light-emission end of the multimode optical fiber.

A laser-light source comprising a plurality of laser-light-source portions each of which includes:

• a heat-dissipation block made of copper or copper alloy;
• a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/° C, have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
• a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
• a multimode optical fiber;
• and
• an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
• wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light-source portions is arranged to constitute a bundle at least at a light-emission end of the multimode optical fiber.

An exposure system comprising a plurality of laser-light sources each of which is provided for exposure and includes:

• a heat-dissipation block made of copper or copper alloy;
• a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/° C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
• a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
• a multimode optical fiber;
• and
• an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
• wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light sources is arranged to constitute a one-dimensional array at least at a light-emission end of the multimode optical fiber.

An exposure system comprising a plurality of laser-light sources each of which is provided for exposure and includes:

• a heat-dissipation block made of copper or copper alloy;
• a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/,C, have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
• a plurality of semiconductor lasers each
• of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
• a multimode optical fiber;
• and
• an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
• wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light sources is arranged to constitute a bundle at least at a light-emission end of the multimode optical fiber.