Circuit board made of resin with pin
AssigneeNgk Spark Plug Co., Ltd.
InventorsNoritaka Miyamoto, Kazuhisa Sato
Life of this patent
Estimating the term…
Abstract
In a flat pin to be used in a circuit board made of resin with pins comprising a rod portion having a diameter of not greater than 0.35 mm and a concentric tabular large diameter portion having a larger diameter than that of the rod portion formed on one end of the rod portion, the ratio (W/S) of the diameter of the large diameter portion to the rod portion is from not smaller than 2.16 to not greater than 2.67 and the ratio (T/S) of the thickness of the large diameter portion to the diameter of the rod portion is from not smaller than 0.40 to not greater than 0.67 supposing that the diameter of the rod portion and the large diameter portion of the flat pin are S and W, respectively, and the thickness of the large diameter portion is T.
Claims5
A circuit board made of resin with pins, comprising:
- flat pins each including:
- a rod portion having a diameter of not greater than 0.35 mm, and
- a concentric tabular large diameter portion having a larger diameter than that of the rod portion formed on one end of the rod portion,
- the flat pins each being soldered to a pin bonding portion provided on a main surface of the board at the large diameter portion, wherein
- the ratio (W/S) of the diameter of the large diameter portion to the rod portion is from not smaller than 2.16 to not greater than 2.67, if the diameter of the rod portion and the large diameter portion of the flat pin are S and W, respectively,
- wherein
- the formed thickness of a solder layer is adjusted to be not greater than 0.30 mm along the vertical direction from the first main surface of the pin bonding portion toward the flat pin.
A circuit board made of resin with pins, comprising:
- flat pins each including:
- a rod portion having a diameter of not greater than 0.35 mm, and
- a concentric tabular large diameter portion having a larger diameter than that of the rod portion formed on one end of the rod portion,
- the flat pins each being soldered to a pin bonding portion provided on a main surface of the board at the large diameter portion, wherein
- the ratio (W/S) of the diameter of the large diameter portion to the rod portion is from not smaller than 2.16 to not greater than 2.67, if the diameter of the rod portion and the large diameter portion of the flat pin are S and W, respectively,
- wherein
- the ratio (T/S) of the thickness of the large diameter portion to the diameter of the rod portion is from not smaller than 0.40 to not greater than 0.67, if the thickness of the large diameter portion is T.
Dependencies are inferred from the claim text.