Printed circuit board and method manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSeiichi Nakatani, Kouichi Hirano
Life of this patent
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Abstract
A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.
Claims16
A circuit component built-in module comprising:
- an insulating substrate formed of a mixture comprising an inorganic filler and a thermosetting resin;
- a plurality of wiring patterns formed on at least one principal plane of the insulating substrate;
- an active component buried in the insulating substrate and electrically connected to at least one of the wiring patterns;
- and
- a passive component buried in the insulating substrate and electrically connected to at least one of the wiring patterns;
- wherein the active component is electrically connected to the passive component by the wiring patterns and the insulating substrate has a coefficient of linear expansion of 8×10−6/° C. to 20×10−6/° C. and a heat conductivity of 1 w/mK to 10 w/mK.
Dependencies are inferred from the claim text.