Small form factor cooling system

A modular computer system for mounting in a multi-tiered support, comprising:

• a computer chassis configured for mounting in the multi-tiered support;
• a first computer component within the computer chassis;
• a means for evaporating liquid coolant from a stream of liquid coolant, using heat from the first computer component, to produce a stream of coolant vapor;
• a means for removing heat from the stream of coolant vapor;
• a means for transferring the removed heat out of the chassis;
• and
• one or more additional computer components within the computer chassis, wherein the means for transferring causes airflow that directly cools the one or more additional components;
• wherein the means for transferring draws air through the condenser, and blows air toward the one or more additional computer components.

A method for cooling a first computer component, comprising:

• mounting a computer chassis of a modular computer system in a multi-tiered support, the first computer component being located within the computer chassis;
• evaporating liquid coolant from a stream of liquid coolant, using heat from the first computer component, to produce a stream of coolant vapor;
• removing heat from the stream of coolant vapor, in a condenser, to form the stream of liquid coolant;
• and
• transferring the removed heat out of the chassis by absorbing the heat in a stream of air drawn through the condenser, wherein the stream of air is blown toward the one or more additional computer components to directly cool the one or more additional computer components.

A modular computer system for mounting in a multi-tiered support, comprising:

• a computer chassis configured for mounting in the multi-tiered support;
• a computer component within the computer chassis;
• an evaporator in thermal communication with the computer component, the evaporator being configured to dissipate heat from the computer component by using that heat to drive a stream of liquid coolant through a phase change into a stream of coolant vapor;
• a condenser configured to dissipate heat from the stream of coolant vapor to add liquid coolant to the stream of liquid coolant;
• and
• an airflow control structure extending substantially across an intermediate portion of the chassis to define two chambers, the airflow control structure including an air mover configured to move air from a first chamber of the two chambers to a second chamber of the two chambers;
• wherein the air mover directs airflow both to cool one or more additional components, and to cool the condenser;
• wherein the chassis includes an intake vent that ventilates the first chamber such that the air mover is configured to draw air into the first chamber through the intake vent;
• and
• wherein the chassis includes an exhaust vent that ventilates the second chamber such that the air mover is configured to move air heated by the condenser from the second chamber through the exhaust vent.

A modular computer system for mounting in a multi-tiered support, comprising:

• a computer chassis configured for mounting in the multi-tiered support;
• a first computer component, which requires cooling, within the computer chassis;
• one or more additional computer components, which require cooling, within the computer chassis;
• a body within the chassis, the body defining a plurality of cooling fins and a fluid passageway in thermal communication with the cooling fins, the fluid passageway being configured to place fluid in thermal communication with the first computer component to dissipate heat from the first computer component via the fins;
• and
• an air mover configured to cool the plurality of cooling fins, wherein the air mover forces air through the cooling fins, and wherein the air mover forces the resulting airflow into thermal communication with the one or more additional computer components.

A modular computer system for mounting in a multi-tiered support, comprising:

• a computer chassis configured for mounting in the multi-tiered support;
• a first computer component within the computer chassis;
• one or more additional computer components within the computer chassis;
• an evaporator in thermal communication with the first computer component, the evaporator being configured to dissipate heat from the first computer component by evaporating liquid coolant from a stream of liquid coolant to produce a stream of coolant vapor;
• a condenser configured to be cooled by dissipating heat from the stream of coolant vapor into an airstream, and thereby to add liquid coolant to the stream of liquid coolant;
• an air mover configured to create the airstream that cools the condenser, wherein the air mover forces the airstream into thermal communication with the one or more additional computer components.