Radio transceiver on a chip
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorsKarl Håkan Torbjörn Gärdenfors, Sven Mattisson, Jacobus Cornelis Haartsen
Life of this patent
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Abstract
An entire radio transceiver can be completely integrated into one IC chip. In order to integrate the IF filters on the chip, a heterodyne architecture with a low IF is used. A single, directly modulated VCO is used for both up-conversion during transmission, and down-conversion during reception. Bond-wires are used as resonators in the oscillator tank for the VCO. A TDD scheme is used in the air interface to eliminate cross-talk or leakage. A Gaussian-shaped binary FSK modulation scheme is used to provide a number of other implementation advantages.
Claims45
A radio for transmitting and receiving, via an antenna, of a plurality of high-frequency signals in a time-division-duplex mode on a single IC chip, the radio comprising:
- a circuit path adapted to connect the antenna to a data output port and to a data input port, wherein the circuit path comprises:
- (1) a bandpass filter for filtering signals derived from received high-frequency signals of the plurality of high-frequency signals;
- (2) a discriminator for detecting a received data signal from a received filtered signal, wherein the received data signal is sent to the data output port;
- (3) an up-conversion section for up-converting an information signal received from the data input port to a high-frequency signal of the plurality of high-frequency signals;
- and
- (4) a shaping filter connected to an input of the up-conversion section;
- wherein the circuit path comprising the bandpass filter, the discriminator, the up-conversion section, and the shaping filter is integrated into the single IC chip;
- and
- wherein bandpass filtering operations are performed by components integrated into the single IC chip.
A radio for transmitting and receiving, via an antenna, of a plurality of high-frequency signals in a time-division-duplex mode on a single IC chip, the radio comprising:
- a circuit path adapted to connect the antenna to a data output port and to a data input port, wherein the circuit path comprises:
- (1) a bandpass filter for filtering signals derived from received high-frequency signals of the plurality of high-frequency signals;
- (2) a discriminator for detecting a received data signal from a received filtered signal, wherein the received data signal is sent to the data output port;
- (3) an up-conversion section for up-converting an information signal received from the data input port to a high-frequency signal of the plurality of high-frequency signals;
- (4) only one variable-controlled oscillator, wherein resonators are implemented for the variable-controlled oscillator without components external to the single IC chip;
- and
- (5) a shaping filter connected to an input of the up-conversion section;
- wherein the circuit path comprising the bandpass filter, the discriminator, the up-conversion section, the variable controlled oscillator, and the shaping filter is integrated into the single IC chip;
- and
- wherein bandpass filtering operations are performed by components integrated into the single IC chip.
A radio for transmitting and receiving a plurality of high-frequency signals in a time-division-duplex mode, the radio comprising:
- an antenna for transmitting and receiving the plurality of high-frequency signals over an air interface;
- a circuit path connecting the antenna to a data output port and to a data input port, wherein the circuit path comprises:
- (1) a bandpass filter for filtering signals derived from received high-frequency signals of the plurality of high-frequency signals;
- (2) a discriminator for detecting a received data signal from a received filtered signal, wherein the received data signal is sent to the data output port;
- (3) an up-conversion circuit for up-converting a data signal received from the data input port to a high-frequency signal of the plurality of high-frequency signals;
- and
- (4) a shaping filter connected to an input of the up-conversion section;
- wherein the circuit path comprising the bandpass filter, the discriminator, the up-conversion section, the shaping filter, and the data input and output ports is integrated into a single IC chip;
- and
- wherein bandpass filtering operations are performed by components integrated into the single IC chip.
Dependencies are inferred from the claim text.