High Q factor integrated circuit inductor

A structure, comprising:

• and inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion of said inductor comprising a conductive liner and a core conductor and said upper portion of said inductor consists only of said core conductor, said core conductor comprising Cu and said liner comprising a dual layer of TaN and Ta.

A structure comprising:

• an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion of said inductor comprising a conductive liner and a core conductor and said upper portion of said inductor consisting only of said core conductor;
• and
• a conductive passivation layer on a top surface and sidewalls of said upper portion of said inductor, said passivation comprising layer a layer of Ni or a layer of Au over a layer of Ni.

A structure, comprising:

• an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion extending a distance of less than 3 microns into said dielectric layer.

A structure, comprising:

• an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and upper portion of said inductor extending above said dielectric layer;
• and
• integral vias extending from said bottom surface of said inductor through said dielectric layer and electrically contacting pass through metallurgy in said substrate.