Test structure embedded in a shipping and handling cover for integrated circuit sockets and method for testing integrated circuit sockets and circuit assemblies utilizing same

An apparatus for testing continuity of electrical paths through an integrated circuit socket of a circuit assembly, comprising:

• a test facilitating shipping and handling cover configured to removably mate within the socket and capacitively couple to electrical paths through socket;
• a capacitive sense plate configured to capacitively couple with the test facilitating shipping and handling cover;
• and
• a tester configured to stimulate nodes on the circuit assembly coupled to the electrical paths through the integrated circuit socket of the circuit assembly and measure electrical characteristics of the integrated circuit socket sensed by the capacitive sense plate.

A method for testing continuity of electrical paths through an integrated circuit socket while a removably matable shipping and handling cover is removably inserted within the socket, comprising:

• capacitively coupling contacts of the socket to a conductive layer of a shipping and handling cover;
• coupling a capacitive sense plate to the removably matable shipping and handling cover;
• stimulating one or more nodes of the socket;
• measuring an electrical characteristic;
• and
• comparing the measured electrical characteristic to at least one threshold to assess continuities of electrical paths through the socket.