Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment

A light-emitting device comprising:

• a panel including a first plastic substrate and a second plastic substrate;
• a flexible tape attached to the panel;
• a light emitting element formed between the first plastic substrate and the second plastic substrate;
• a drying agent formed in contact with an end face of the panel and with the flexible tape;
• a first insulating film covering the first plastic substrate and the second plastic substrate;
• a second insulating film covering the first insulating film;
• a third insulating film covering the second insulating film;
• and
• a plastic film covering the third insulating film,
• wherein an internal stress of the second insulating film is smaller than that of the first insulating film and that of the third insulating film.

A light-emitting device comprising:

• a light emitting element formed over a substrate;
• a flexible tape attached to the substrate;
• a drying agent formed in contact with an end face of the substrate and with the flexible tape;
• a plurality of insulating films covering the substrate and the light emitting element;
• and
• a plastic film covering the plurality of insulating films,
• wherein an internal stress of at least one of the plurality of insulating films is smaller than those of the other insulating films.

A light-emitting device comprising:

• a light emitting element formed over a substrate;
• a flexible tape attached to the substrate;
• a drying agent formed in contact with an end face of the substrate and with the flexible tape;
• a first insulating film covering the substrate and the light emitting element;
• a second insulating film covering the first insulating film;
• a third insulating film covering the second insulating film;
• and
• a plastic film covering the third insulating film,
• wherein an internal stress of the second insulating film is smaller than that of the first insulating film and that of the third insulating film.

A semiconductor device comprising:

• a plurality of thin film transistors formed over a substrate;
• a flexible tape attached to the substrate;
• a drying agent formed in contact with an end face of the substrate and with the flexible tape;
• a plurality of insulating films covering the substrate and the plurality of thin film transistors;
• and
• a plastic film covering the plurality of insulating films,
• wherein an internal stress of at least one of the plurality of insulating films is smaller than those of the other insulating films.

A semiconductor device comprising:

• a plurality of thin film transistors formed over a substrate;
• a flexible tape attached to the substrate;
• a drying agent formed in contact with an end face of the substrate and with the flexible tape;
• a first insulating film covering the substrate and the plurality of thin film transistor;
• a second insulating film covering the first insulating film;
• a third insulating film covering the second insulating film;
• and
• a plastic film covering the third insulating film,
• wherein an internal stress of the second insulating film is smaller than that of the first insulating film and that of the third insulating film.

A semiconductor device comprising:

• a plurality of thin film transistors formed over a plastic substrate;
• a flexible tape attached to the plastic substrate;
• a drying agent formed in contact with an end face of the plastic substrate and with the flexible tape;
• a plurality of insulating films covering the plastic substrate and the plurality of thin film transistors;
• and
• a plastic film covering the plurality of insulating films,
• wherein an internal stress of at least one of the plurality of insulating films is smaller than those of the other insulating films.

A semiconductor device comprising:

• a plurality of thin film transistors formed over a plastic substrate;
• a flexible tape attached to the plastic substrate;
• a drying agent formed in contact with an end face of the plastic substrate and with the flexible tape;
• a first insulating film covering the plastic substrate and the plurality of thin film transistor;
• a second insulating film covering the first insulating film;
• a third insulating film covering the second insulating film;
• and
• a plastic film covering the third insulating film,
• wherein an internal stress of the second insulating film is smaller than that of the first insulating film and that of the third insulating film.