Liquid epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKazuaki Sumita, Toshio Shiobara
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Abstract
A liquid epoxy resin composition is provided comprising (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) acrylic submicron particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate and/or alkyl methacrylate as a monomeric component, the core having a Tg of up to −10° C., the shell having a Tg of 80-150° C. The composition is adherent to surfaces of silicon chips, especially polyimide resins and nitride film and useful as sealant for flip chip type semiconductor devices.
Claims11
A liquid epoxy resin composition comprising
- (A) a liquid epoxy resin,
- (C) a curing accelerator,
- (D) an inorganic filler, and
- (E) acrylic particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate or alkyl methacrylate or both as a monomeric component, the core having a glass transition temperature of up to −10° C., the shell having a glass transition temperature of 80 to 150° C., the particles having an average particle size of 0.1 to 1.0 μm,
- said acrylic particles (E) being present in an amount of 0.5 to 20 parts by weight per 100 parts by weight of the liquid epoxy resin (A).
A liquid epoxy resin composition comprising
- (A) a liquid epoxy resin,
- (B) a curing agent,
- (C) a curing accelerator,
- (D) an inorganic filler, and
- (E) acrylic particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate or alkyl methacrylate or both as a monomeric component, the core having a glass transition temperature of up to −10° C., the shell having a glass transition temperature of 80 to 150° C., the particles having an average particle size of 0.1 to 1.0 μm,
- said acrylic particles (E) being present in an amount of 0.5 to 20 parts by weight per 100 parts by weight of the liquid epoxy resin (A) and the curing agent (B) combined.
Dependencies are inferred from the claim text.