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US 7,067,924 B2Granted
Nickel bonding cap over copper metalized bondpads
AssigneeMicron Technology, Inc.
InventorsJeffery N. Gleason, Joseph T. Lindgren
Life of this patent
Estimating the term…
Abstract
A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.
Claims17
A contact pad for an electronic circuit, comprising:
- a substrate having a contact region;
- a copper pad disposed on the substrate in electrical contact with the contact region;
- a nickel layer disposed over the copper pad, the nickel layer comprising phosphorous and nickel;
- and
- a catalytically active layer disposed between the copper pad and the nickel layer.
2 more elements
An integrated circuit package comprising:
- at least one electronic chip having a contact pad, the contact pad comprising:
- a substrate having a contact region;
- a copper pad disposed on the substrate in electrical contact with the contact region;
- and
- a nickel layer disposed over the copper pad, the nickel layer comprising phosphorous and nickel;
- and
- a catalytically active layer disposed between the copper pad and the nickel layer.
4 more elements
Dependencies are inferred from the claim text.