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US 7,067,914 B2Granted
Dual chip stack method for electro-static discharge protection of integrated circuits
AssigneeInternational Business Machines Corporation
InventorsJohn C. Malinowski, Edmund J. Sprogis, Steven H. Voldman
Life of this patent
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Abstract
Disclosed is an electronic device comprising a semiconductor chip including an integrated circuit having at least one electrostatic discharge sensitive device and a non-semiconductor chip, positioned in close proximity to the semiconductor chip, the non-semiconductor chip having at least one electrostatic discharge protection device. The electrostatic discharge protection device is electrically connected to the electrostatic discharge sensitive device.
Claims33
An electronic device comprising:
- a semiconductor chip including an integrated circuit having at least one electrostatic discharge sensitive device;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, positioned in close proximity to said semiconductor chip, said non-semiconductor chip having at least one electrostatic discharge protection device formed on said substrate, said electrostatic discharge protection device electrically connected to said electrostatic discharge sensitive device.
An electronic device comprising:
- a semiconductor chip including an integrated circuit;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, positioned in close proximity to said semiconductor chip, said non-semiconductor chip having at least one electrostatic discharge sensitive device formed on said substrate and at least one electrostatic discharge protection device, said electrostatic discharge protection device electrically connected to said electrostatic discharge sensitive device.
An electronic device comprising:
- a semiconductor chip including an integrated circuit having at least one first electrostatic discharge sensitive device;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, positioned in close proximity to said semiconductor chip, said non-semiconductor chip having at least one second electrostatic discharge sensitive device and at least one first electrostatic discharge protection device and at least one second electrostatic discharge protection device formed on said substrate, said first electrostatic discharge protection device electrically connected to said first electrostatic discharge sensitive device and said second electrostatic discharge protection device electrically connected to said second electrostatic discharge sensitive device.
An electronic device comprising:
- a dual chip stack comprising:
- a semiconductor chip including an integrated circuit having at least one electrostatic discharge sensitive device;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, attached to said semiconductor chip, said non-semiconductor chip having at least one electrostatic discharge protection device formed on said substrate, said electrostatic discharge protection device electrically connected to said electrostatic discharge sensitive device.
1 more element
An electronic device comprising:
- a dual chip stack comprising:
- a semiconductor chip including an integrated circuit;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, attached to said semiconductor chip, said non-semiconductor chip having at least one electrostatic discharge sensitive device and at least one electrostatic discharge protection device formed on said substrate, said electrostatic discharge protection device electrically connected to said electrostatic discharge sensitive device.
1 more element
An electronic device comprising:
- a dual chip stack comprising:
- a semiconductor chip including an integrated circuit having at least one first electrostatic discharge sensitive device;
- and
- a non-semiconductor chip formed of an electrically insulating material, positioned in close proximity to said semiconductor chip, said non-semiconductor chip having at least one second electrostatic discharge sensitive device and at least one first electrostatic discharge protection device and at least one second electrostatic discharge protection device, said first electrostatic discharge protection device electrically connected to said first electrostatic discharge sensitive device and said second electrostatic discharge protection device electrically connected to said second electrostatic discharge sensitive device.
1 more element
An electronic device comprising:
- a dual chip stack mounted on a module, said dual chip stack comprising:
- a semiconductor chip including an integrated circuit having at least one electrostatic discharge sensitive device;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, attached to said semiconductor chip, said non-semiconductor chip having at least one electrostatic discharge protection device formed on said substrate, said electrostatic discharge protection device electrically connected to said electrostatic discharge sensitive device.
1 more element
An electronic device comprising:
- a dual chip stack mounted on a module, said dual chip stack comprising:
- a semiconductor chip including an integrated circuit;
- and
- a non-semiconductor chip having a substrate formed of an electrically insulating material, attached to said semiconductor chip, said non-semiconductor chip having at least one electrostatic discharge sensitive device and at least one electrostatic discharge protection device formed on said substrate, said electrostatic discharge protection device electrically connected to said electrostatic discharge sensitive device.
1 more element
An electronic device comprising:
- an integrated circuit chip comprising a semiconductor substrate and an integrated circuit, said integrated circuit having an electrostatic discharge sensitive device;
- and
- an electrostatic discharge protection chip comprising a non-semiconductor substrate and an electrostatic discharge protection device, said electrostatic discharge protection chip positioned in close proximity to said integrated circuit chip, said electrostatic discharge protection device electrically and directly connected by only metal conductors to said electrostatic discharge sensitive device or only metal conductors and semiconductor devices of said integrated circuit chip.
Dependencies are inferred from the claim text.