Semiconductor package having improved adhesiveness and ground bonding
AssigneeAmkor Technology, Inc.
InventorSung Sik Jang
Life of this patent
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Abstract
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.
Claims11
A semiconductor package, comprising:
- a chip paddle having opposed top and bottom paddle surfaces;
- a ground ring defined by a peripheral portion of the chip paddle, the ground ring defining opposed top and bottom ring surfaces;
- a semiconductor chip attached to the top surface of the chip paddle;
- a plurality of leads having opposed top and bottom lead surfaces and extending at least partially about the chip paddle in spaced relation thereto, the ground ring being positioned between the semiconductor chip and the leads, with the semiconductor chip being electrically connected to at least one of the leads;
- and
- an encapsulation material covering the chip paddle, the ground ring, the semiconductor chip and the leads such that at least portions of the bottom lead surfaces of the leads are exposed therein.
Dependencies are inferred from the claim text.