Semiconductor package having angulated interconnect surfaces

Abstract

Improved electro-mechanical connections between a packaged semiconductor die (12) and a printed circuit board (60) with reduced standoff height and pitch are created by the use of a non-planar semiconductor package substrate (24) having a surface with angulated portions. Electrically conductive surfaces (54) are formed over the angulated portions. In one embodiment, the electrically conductive surfaces may be formed by forming an electrically conductive surface (54) over a non-planar or angulated package substrate (42). The electrically conductive angulated surfaces improve reliability of solder joints (70) upon connecting the packaged semiconductor die to the printed circuit board (60). The gaps within the solder mask openings provide a thin profile and improved pitch. In one form, the die may be on a same side of the package as the angulated substrate surface.

Dependencies are inferred from the claim text.