Multi-electron beam exposure method and apparatus
AssigneesHitachi, Ltd., Canon Kabushiki Kaisha, Advantest Corporation
InventorsHaruo Yoda, Yasunari Souda, Hiroya Ohta, Yoshikiyo Yui, Shinichi Hashimoto
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AssigneesHitachi, Ltd., Canon Kabushiki Kaisha, Advantest Corporation
InventorsHaruo Yoda, Yasunari Souda, Hiroya Ohta, Yoshikiyo Yui, Shinichi Hashimoto
Estimating the term…
The dimension of the main field as a unit region for exposure is set to an integral submultiple of the arrangement pitch of the LSI to be exposed, by the control computer 62, and the exposure data stored in the form associated with electron beams from a data generation circuit 64 is limited to one-chip data alone in units of a stripe. This data is repeatedly read out to write the stripe. Further, a storage circuit 66 is provided to store the exposure data by means of a double buffer memory unit for each electron beam. While LSI is written according to one of the buffers, the next exposure stripe data is prepared on the other buffer, thereby bringing about a substantial reduction in the required speed of the exposure data generation circuit.
A multi-electron beam exposure method, wherein multiple electron beams are applied to a sample surface mounted on a traveling sample stage to perform repeated exposure of chip patterns wherein the method comprises the steps of:
A multi-electron beam exposure apparatus comprising:
Dependencies are inferred from the claim text.