US 7,067,742 B2 · Connection component with peelable leads

Abstract

A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

Claims1

Dependent claims

A connection component for a semiconductor assembly, said component comprising:

A. a support structure having a dielectric layer and a top surface;
B. a copper layer disposed over the top surface, said copper layer having a plurality of first regions and a second region;
C. a plurality of graphite regions disposed over the plurality of first regions, each of said plurality of graphite regions associated with one of said plurality of first regions and prepared by depositing graphite over the associated first regions;
and
D. a plurality of leads disposed over the copper layer, each said lead having a terminal end permanently attached to said second region;
and a tip end offset from the terminal end, associated with one of said plurality of graphite regions, and releasably connected to the associated graphite region.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/033,988Filed 28 Dec 2001 · division

Priority

25 Nov 1997

Published

US 2002/0081781 A127 Jun 2002

Granted

27 Jun 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10W 72/00
Interconnections or connectors in packages
H05K 3/4092
Forming printed elements for providing electric connections to or between printed circuits: integral conductive tabs, i.e. conductive parts partly…
Y10T 29/49126
On flat or curved insulated base, e.g., printed circuit, etc.: assembling bases
Y10T 29/49147
On flat or curved insulated base, e.g., printed circuit, etc.: assembling terminal to base

Family

Application60/066,297Us provisional application · filed 25 Nov 1997

Application09/200,100Parent of this division · filed 25 Nov 1998

US 2002/0081781 A1Pre-grant publication · published 27 Jun 2002

US 6,357,112 B1Parent of this division

US 7,067,742 B2This patent

From the US filing history. Foreign family members aren’t listed.

Connection component with peelable leads

Life of this patent

Connection component with peelable leads

Life of this patent

Abstract

Claims1