Method of manufacturing an electronic device
AssigneeKoninklijke Philips Electronics N.V.
InventorsRobertus Adrianus Maria Wolters, Anouk Maria Van Graven Claassen
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Abstract
The present invention provides for a method of providing copper metallization on a semiconductor body, including the step of depositing copper in a nitrogen-containing atmosphere so as to form a nitrogen-containing copper seed layer and forming the copper metallization on the seed layer, and also including the step of heating the seed layer so as to release the nitrogen to form part of a barrier layer separating the seed layer from the semiconductor body.
Claims8
A method of manufacturing an electronic device provided with a copper metallization on a substrate, which copper metallization includes a seed layer and a copper metallization layer, which method comprises the steps of:
- depositing copper in a nitrogen-containing atmosphere so as to form a nitrogen containing copper seed layer;
- heating the seed layer so as to release the nitrogen to form part of a barrier layer separating the seed layer from the substrate, and subsequently
- applying the copper metallization layer on the seed layer.
Dependencies are inferred from the claim text.