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US 7,067,423 B2Granted
Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorHiroshi Ohara
Life of this patent
Estimating the term…
Abstract
An electroless plating apparatus includes: a storage tank for an electroless plating solution; a blocking member which blocks the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposite side to the treatment side, the treatment side being a side facing the electroless plating solution; and a solution supplier which causes the electroless plating solution to flow so that the electroless plating solution comes in contact with the treatment side of the semiconductor wafer.
Claims14
A method of manufacturing a semiconductor wafer having bumps comprising:
- installing a semiconductor wafer having a plurality of pads in a storage tank of an electroless plating solution, and blocking the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposite side to the treatment side by means of a blocking member, the treatment side being a side facing the electroless plating solution;
- and
- forming bumps on the respective pads from the electroless plating solution by allowing the electroless plating solution to flow by means of a solution supplier so that the electroless plating solution comes in contact with the treatment side of the semiconductor wafer.
Dependencies are inferred from the claim text.