Semiconductor package and method of fabricating same
AssigneeOki Electric Industry Co., Ltd.
InventorsMakoto Terui, Takahiro Oka
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor chip provided with a plurality of electric terminals and a plurality of electrically conductive members electrically connected with the electric terminals. Connection terminals that are spherical in shape and made of solder are electrically connected with the electrically conductive members. A sealing member is used for sealing the semiconductor chip and the electrically conductive members, and for covering the connection terminals so as to allow a part thereof to be exposed. The electrically conductive members are provided with bonding promoters and are connected with the respective spherical connection terminals at the respective bonding promoters.
Claims15
A semiconductor package, comprising:
- an electrically conductive member having a spherical terminal;
- a semiconductor chip which is electrically connected to said electrically conductive members;
- and
- a sealing member for sealing said electrically conductive members and said semiconductor chip therein;
- wherein a part of said spherical terminal is exposed from said sealing member, and said spherical terminal is electrically connected to said electrically conductive member via a protrusion formed on said electrically conductive member.
A semiconductor package for a semiconductor chip, comprising:
- a lead;
- means for connecting the lead to the semiconductor chip;
- a solder ball connected to the lead;
- and
- an injection-molded body in which the semiconductor chip and at least a portion of the lead are embedded, the body having a top portion and a bottom portion, the solder ball protruding through the bottom portion of the body,
- wherein the top portion of the body has a recess directly above the solder ball, the recess exposing the lead.
A semiconductor package for a semiconductor chip, comprising:
- a lead having a protruding spike;
- means for connecting the lead to the semiconductor chip;
- a solder ball connected to the lead, with the spike extending into the solder ball;
- and
- an injection-molded body in which the semiconductor chip and at least a portion of the lead are embedded.
Dependencies are inferred from the claim text.