Method of fabricating microelectronic package having a bumpless laminated interconnection layer

A method of fabricating a microelectronic package, comprising:

• providing a microelectronic package core having a first surface and an opposing second surface, said microelectronic package core having at least one opening defined therein extending from said microelectronic package core first surface to said microelectronic package core second surface;
• disposing at least one microelectronic die within said at least one opening, said at least one microelectronic die having an active surface;
• adhering said microelectronic package core to said at least one microelectronic die with an encapsulation material including an encapsulation material surface;
• and
• abutting a laminated interconnector proximate said microelectronic die active surface and said encapsulation material surface, wherein said laminated interconnector makes electrical contact with said microelectronic die active surface.

A method of fabricating a microelectronic package, comprising:

• providing a heat spreader having a first surface, said heat spreader having at least one recess defined therein by at least one sidewall extending from said heat spreader first surface to a recess bottom surface;
• disposing at least one microelectronic die within said at least one recess, said at least one microelectronic die having an active surface, a back surface, and at least one side;
• adhering said at least one microelectronic die back surface to said recess bottom surface;
• and
• disposing a laminated interconnector proximate said microelectronic die active surface and said heat spreader, wherein said laminated interconnector makes electrical contact with said microelectronic die active surface and wherein disposing said laminated interconnector against said microelectronid die active surface further comprises attaching conductive plug of said laminated interconnector to an electrical contact of said microelectronic die active surface with a conductive adhesive.

A method of fabricating a microelectronic package, comprising:

• providing a heat spreader having a first surface, said heat spreader having at least one recess defined therein by at least one sidewall extending from said heat spreader first surface to a recess bottom surface;
• disposing at least one microelectronic die within said at least one recess, said at least one microelectronic die having an active surface, a back surface, and at least one side;
• adhering said at least one microelectronic die back surface to said recess bottom surface, wherein adhering said at least one microelectronic die back surface to said recess bottom surface comprises adhering said at least one microelectronic die back surface to said bottom surface with a thermally conductive material selected from the group consisting of metal and metal alloys;
• and
• disposing a laminated interconnector proximate said microelectronic die active surface and said heat spreader, wherein said laminated interconnector makes electrical contact with said microelectronic die active surface:
• and disposing a filler material in gaps between said at least one recess sidewall and said at least one microelectronic die side.