Vertical integrated package apparatus and method

A method of fabricating integrated circuits from a plurality of semiconductor dice, each semiconductor die defining a top side and a bottom side, the method comprising:

• attaching the bottom sides of at least two of the plurality of semiconductor dice to a substrate so that at least two of the plurality of semiconductor dice are in adjacent disposition and define one or more bending regions;
• creating a planar processing area for subsequent seamless high density thin film interconnect on the top sides of at least two of the plurality of semiconductor dice and the one or more bending regions so that at least two of the plurality of semiconductor dice are electrically interconnected;
• removing the substrate from the bottom sides of at least two of the plurality of semiconductor dice wherein the step of removing the substrate comprises the step of performing laser ablation;
• and
• bending the thin film interconnect at the one or more bending regions.

A method of fabricating integrated circuits from a plurality of semiconductor dice, each semiconductor die defining a top side and a bottom side, the method comprising:

• attaching the bottom sides of at least two of the plurality of semiconductor dice to a substrate so that at least two of the plurality of semiconductor dice are in adjacent disposition and define one or more bending regions;
• creating a planar processing area for subsequent seamless high density thin film interconnect on the top sides of at least two of the plurality of semiconductor dice and the one or more bending regions so that at least two of the plurality of semiconductor dice are electrically interconnected;
• removing the substrate from the bottom sides of at least two of the plurality of semiconductor dice;
• singulating at least two of the plurality of semiconductor dice into sub-pluralities of semiconductor die by etching dielectric layers along unused sides of the dice;
• and
• bending the thin film interconnect at the one or more bending regions.

A method of fabricating an assembly of integrated circuits, comprising:

• adjacently positioning at a substrate at least two semiconductor dice, each of the at least two semiconductor dice having a top side and a bottom side;
• defining a bending region common to at least two of the plurality of semiconductor dice;
• creating a flexible member on the top sides of at least two of the plurality of semiconductor dice and across the bending region;
• creating flexible electrical interconnections in the flexible member to electrically connect at least two of the plurality of semiconductor dice;
• backgrinding the substrate from the bottom sides of at least two of the plurality of semiconductor dice;
• and
• bending the flexible member at the bending region to form a multidimensional interconnected dice structure.