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US 7,067,344 B1Granted
Method of manufacturing an external force detection sensor
AssigneeMurata Manufacturing Co., Ltd.
InventorTakahiro Oguchi
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an external force detection sensor in which a sensor element is formed by through-hole dry etching of an element substrate, and an electrically conductive material is used as an etching stop layer during the dry etching.
Claims13
A method of manufacturing an external force detection sensor comprising the steps of:
- providing a semiconductor element substrate;
- forming a recess in a surface of the semiconductor element substrate;
- forming an etching stop layer of an electrically conductive material on the surface of the semiconductor element substrate having the recess formed therein;
- through-hole dry etching the surface of the semiconductor element substrate using the etching stop layer;
- forming a sensor element including a vibrating body, fixed electrodes and movable electrodes on the semiconductor element substrate;
- removing the etching stop layer;
- and
- completing the manufacturing of the external force detection sensor.
5 more elements
A method of manufacturing an external force detection sensor comprising the steps of:
- forming a recessed part on a back surface side of a semiconductor element substrate;
- forming a membrane on a front surface side;
- providing an etching stop layer comprising an electrically conductive material on a top surface of the recessed part of said semiconductor element substrate;
- joining the back surface side of said semiconductor element substrate with a support substrate;
- forming a sensor element including a vibrating body, fixed electrodes and movable electrode by dry etching of the membrane of said semiconductor element substrate;
- removing the etching stop layer;
- and
- completing the manufacturing of the external force detection sensor.
5 more elements
A method of manufacturing an external force detection sensor comprising the steps of:
- providing a semiconductor element substrate;
- providing a support substrate;
- forming a recess in a surface of the semiconductor element substrate;
- providing an etching stop layer comprising an electrically conductive material on a back surface of said semiconductor element substrate;
- joining a back surface side of said semiconductor element substrate with a surface of the support substrate having said recess formed therein;
- and
- forming a sensor element including a vibrating body, fixed electrodes and movable electrodes by dry etching of said semiconductor element substrate;
- removing the etching stop layer;
- and
- completing the manufacturing of the external force detection sensor.
7 more elements
Dependencies are inferred from the claim text.