US 7,067,338 B2 · Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections

Abstract

ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification).

Claims11

Dependent claims

A method of manufacturing a display device, comprising:

providing a semiconductor substrate that includes an arrangement of a plurality of semiconductor devices having electric connection contacts on their surfaces,
mutually isolating the semiconductor devices in a surface region of the semiconductor substrate,
providing a second substrate that includes conductors arranged in a conductor pattern corresponding to pixels of the display device at least at locations of the semiconductor devices,
coupling the electric connection contacts on the semiconductor substrate to the conductors on the second substrate, and
separating the semiconductor devices from the semiconductor substrate.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/787,674Filed 26 Feb 2004 · division

Priority

EP 0120030226 Jan 2001

Published

US 2004/0175869 A19 Sep 2004

Granted

27 Jun 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

G02F 1/1362
Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit: active…
H10H 29/10
Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00:…
H10W 90/00
Package configurations
G02F
Optical devices or arrangements for the control of light by modification of

Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections

Life of this patent

Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections

Life of this patent

Abstract

Claims11