Tape carrier package and method of fabricating the same
AssigneeLG. Philips LCD Co., Ltd.
InventorHyoung Soo Cho
Life of this patent
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Abstract
A tape carrier package with a widow that is capable of confirming an alignment extent between the tape carrier package and a print wiring board in bonding the tape carrier package mounted with an integrated circuit on the liquid crystal panel and the print wiring board. In the package, the integrated circuit is mounted onto a base film. Input pads are connected to the integrated circuit and formed on the base film. Dummy pads are formed at the left and right side thereof not to be connected to the integrated circuit. Windows are provided by opening the base film adjacent to the dummy pads to expose at least two of said dummy pads.
Claims30
A method of jointly adhering a print wiring board to a tape carrier package including input pads on a base film, at least one dummy pad formed at a side of the input pads, and a window for exposing a portion of the at least one dummy pad, said method comprising the steps of:
- adhering the input pads and the at least one dummy pad of the tape carrier package to a wiring of the print wiring board to correspond to each other with an isotropic conductive film therebetween;
- and
- confirming an alignment of the at least one dummy pad to a dummy pad on the printed wiring board with the aid of the window.
Dependencies are inferred from the claim text.