Joined bodies and a method of producing the same
AssigneeNGK Insulators, Ltd.
InventorsTomoyuki Fujii, Hideyoshi Tsuruta, Tetsuya Kawajiri
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Abstract
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains at least indium and at least one material containing at least a component capable of reducing the melting point of indium and is provided between the first and second members to provide a laminate. The laminate is heated at a temperature in a solid-liquid coexisting range of an alloy comprising indium and the indium melting point reducing component to join the first and second members.
Claims15
A method of producing a joined body including a first member comprising at least a ceramic and a second member comprising at least one of a metal and a metal composite, said method comprising the steps of:
- providing an indium-based metal adhesive comprising indium and tin wherein tin is present in an amount of no more than 10 wt %;
- placing said metal adhesive between said first and second members to provide a laminate;
- and
- heating said laminate at a temperature in a solid-liquid coexisting range of an alloy comprising indium and tin to join said first and second members.
A joined body comprising:
- a first member comprising at least a ceramic semiconductor wafer supporting member;
- a second member comprising at least one of a metal and a metal composite;
- and
- an indium-based joining layer provided between said first and second members, said joining layer comprising indium and tin wherein tin is present in an amount of no more than 10 wt %.
Dependencies are inferred from the claim text.