Back to results
US 7,067,193 B2Granted
Structure and method for improved adhesion between two polymer films
AssigneeInternational Business Machines Corporation
InventorsFrank D. Egitto, Luis J. Matienzo
Life of this patent
Estimating the term…
Abstract
A method for improving the adhesion between polyimide layers and the structure formed by the method. A silicon oxide-containing layer is formed on the surface of a polyimide layer and a second layer of polyimide is formed on the silicon oxide-containing layer.
Claims8
A composite structure comprising, in order:
- a substrate;
- a polymeric layer including a first polymeric material
- in which the first polymeric material is a polyimide;
- a layer consisting essentially of silicon-oxide;
- and
- an added layer including a second polymeric material selected from the group consisting of polyimides, polyolefins, polyepoxides, polyurethanes, and polycarbonates.
3 more elements
Dependencies are inferred from the claim text.