Method and apparatus for sealing electrical contacts during an electrochemical deposition process
AssigneeApplied Materials, Inc.
InventorsArthur Keigler, Harald Herchen, Vincent E. Burkhart, Son N. Trinh
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AssigneeApplied Materials, Inc.
InventorsArthur Keigler, Harald Herchen, Vincent E. Burkhart, Son N. Trinh
Estimating the term…
An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.
An apparatus for securing a substrate in a processing system, comprising:
An apparatus for securing a substrate in a processing system, comprising:
An apparatus for securing a substrate in a processing system, wherein the substrate includes a plating side, a back side, and an edge, comprising:
An apparatus for securing a substrate in a processing system, wherein the substrate includes a plating side, a back side, and an edge, comprising:
Dependencies are inferred from the claim text.