Chemical liquid processing apparatus for processing a substrate
AssigneeKabushiki Kaisha Toshiba
InventorsShinichi Ito, Riichiro Takahashi, Tatsuhiko Ema, Katsuya Okamura
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Abstract
In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.
Claims7
A chemical liquid processing apparatus for processing a substrate using chemical liquid, comprising:
- a substrate holding portion for holding a substrate;
- a plate disposed above said substrate holding portion and having a vertically extending air intake hole and a liquid contacting surface;
- a flow control wall having a top face extended over the substrate holding portion so as to surround said substrate holding portion and for preventing air around the substrate holding portion from being sucked;
- and
- a rotating mechanism for rotating said plate,
- wherein
- a side face of said substrate holding portion has an invertedly-inclined gradient,
- the top face of said flow control wall having a gradient substantially parallel to the gradient of the side face of said substrate holding portion,
- a negative pressure is capable of being generated between the plate and the substrate held by the substrate holding portion by rotation of said plate, so that
- a gas flow is generated between said substrate and said plate by sucking air through said air intake hole.
Dependencies are inferred from the claim text.