US 7,066,800 B2 · Conductive polishing article for electrochemical mechanical polishing

Abstract

An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

Claims67

Dependent claims

A polishing article for polishing a substrate, comprising:

a body having a polishing surface adapted to polish the substrate;
at least one conductive element embedded in the polishing surface, wherein the conductive element has a contact surface that extends beyond a plane defined by the polishing surface;
and
one or more pockets formed in the polishing surface, wherein the conductive element is disposed in at least one of the pockets.

1 more element

Dependencies are inferred from the claim text.

Conductive polishing article for electrochemical mechanical polishing

Life of this patent

Conductive polishing article for electrochemical mechanical polishing

Life of this patent

Abstract

Claims67