Area array package with low inductance connecting device
AssigneeInternational Business Machines Corporation
InventorsJean Audet, Luc Guerin, Jean-Luc Landreville, Gerald Pieree Audet
Life of this patent
Estimating the term…
Abstract
An area-array integrated circuit package assembly are provided with a plurality of electrically conductive connectors attached to the package I.O. pads, that are used to connect the package to a printed circuit card or other component. The connectors comprise at least two parallel conductors flexing together in the same direction, electrically insulated from each other for a portion of their length between the package and printed circuit card to provide for reduced interconnection inductance. The connection with the component contact pads can be achieved by mechanically pressing the package and circuit card together or with the use of bonding material.
Claims25
An assembly of an integrated circuit package and a substrate comprising;
- a plurality of input/output (I/O) pads located in an area-array configuration on a surface of the integrated circuit package;
- a plurality of contact pads on a surface of said substrate;
- a plurality of electrically conductive connectors, each comprising a first contact surface, a second contact surface, and a flexible portion interconnecting said first and second contact surfaces;
- each said flexible portion is comprised of at least two parallel and flexible conductors flexed in the same direction, wherein said conductors are electrically insulated from each other for a portion of their lengths;
- the first contact surface of each of said connectors is joined to an I/O pad of the package;
- and
- the second contact surface of each of said connectors contacts a contact pad on said substrate;
- whereby each I/O pad on the surface of the integrated circuit package is electrically connected to a contact pad on the substrate by a connector.
An integrated circuit package comprising:
- a plurality of input/output (I/O) pads located in an area-array configuration on a surface of the integrated circuit package;
- a plurality of electrically conductive connectors, each comprising a first contact surface, a second contact surface, and a flexible portion interconnecting said first and second contact surfaces;
- each said flexible portion is comprised of at least two parallel and flexible conductors flexed in the same direction, wherein said conductors are electrically insulated from each other for a portion of their lengths;
- the first contact surface of each of said connectors is joined to an I/O pad on the surface of the package, and said second contact surface of each of said connectors is available for connection to a substrate.
A connector for electrically interconnecting an input/output (I/O) pad located in an area-array configuration of I/O pads on a surface of an integrated circuit package and one of a plurality of contact pads on a surface of a substrate, said connector comprising;
- a first contact surface;
- a second contact surface;
- a flexible portion is comprised of at least two parallel and flexible conductors wherein each of said conductors can be flexed in the same direction at the same time, wherein said conductors are electrically insulated from each other for a portion of their lengths;
- and wherein said at least two parallel and flexible conductors are joined together at their extremities to form said first and second contact surfaces at opposite extremities.
Dependencies are inferred from the claim text.