Wafer engine
AssigneeAsyst Technologies, Inc.
InventorsAnthony C. Bonora, Richard H. Gould, Roger G. Hine, Michael Krolak, Jerry A. Speasl
Life of this patent
Estimating the term…
Abstract
An integrated system is disclosed for workpiece handling and/or inspection at the front end of a tool. The system comprises a rigid member of unitary construction such as a metal plate which mounts to the front of a tool associated with a semiconductor process. The front end components, including the load port assemblies, prealigners and workpiece handling robot, are mounted to the plate to provide precise and repeatable positioning of the front end components with respect to each other.
Claims13
A wafer engine for moving semiconductor workpieces, comprising:
- a linear drive assembly having a carriage, said linear drive assembly for moving said carriage between a first position and a second position along a first linear path, said first linear path defining an x-axis;
- a support column having a first end a second end, and a longitudinal central axis;
- a rotational drive housing mounted to said carriage, said rotational drive housing substantially enclosing a rotational drive being adapted to affix to said first end of said support column for rotating said support column about said longitudinal central axis, said longitudinal central axis defining a substantially vertical theta axis that is substantially perpendicular to said x-axis;
- a vertical drive column extending upward from a support member having a first end and a second end, said first end of said support member mounted to said second end of said support column such that said rotational drive rotates said support member and said vertical drive column about said theta axis;
- a z-axis drive assembly having a mechanism being adapted to move vertically within said vertical drive column between a first position and a second position along a second linear path;
- a slide body mounted to said mechanism, said slide body substantially enclosing a radial drive assembly being adapted to move an end effector between a first position and second position along a third linear path, said third linear path defining a radial axis;
- and
- wherein said theta axis is offset from a z-axis traveling substantially through the geometric center of said slide body.
A wafer engine for transporting semiconductor wafers, comprising:
- a first drive assembly having a mounting element, said first drive assembly being adapted to move said mounting element between a first position and a second position along a first linear path, said first linear path defining an x-axis;
- a support column having a first end and a second end;
- a rotational drive housing mounted to said mounting element, said housing substantially enclosing a rotational drive that is and affixed to said first end of said support column, said rotational drive being adapted to rotate said support column about a longitudinal central axis of said support column, said longitudinal central axis defining a theta-axis;
- a substantially L-shaped z-axis drive housing having a vertical drive column extending from a support member that is affixed to said second end of said support column, said vertical drive column substantially enclosing a z-axis drive assembly having a mechanism being adapted to move vertically between a first position and a second position along a second linear path;
- a slide body removably mounted to said mechanism, said slide body substantially enclosing a radial drive assembly having a second mechanism being adapted to move between a first position and a second position along a third linear path, said third linear path defining a radial axis;
- an end effector mounted to said second mechanism;
- and
- wherein said theta axis is offset from a z-axis traveling substantially through the geometric center of said slide body.
Dependencies are inferred from the claim text.