US 7,066,372 B2 · Recognition device, bonding device, and method of manufacturing a circuit device

Abstract

The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21 provided with recognition device, a shimmer prevention blow mechanism 31 is disposed between a ring illumination 25 and a working hole 24 and near working hole 24. Though the nitrogen gas that blows out from working hole 24 gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism 31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the μm order can be improved.

Claims10

Dependent claims

A semiconductor device manufacturing method comprising:

preparing an assembling apparatus comprising a cover, having an opening therein, provided on a setting base comprising a heating function;
setting a plate-like substrate having conductive patterns mounted on the setting base;
and
mounting a semiconductor chip to the substrate or wire-bonding electrodes of the semiconductor chip to the conductive patterns through the opening,
wherein an illumination is disposed above the opening and a blowing device is provided at a periphery part of the illumination in order to prevent a fluctuation of an inert gas generated by the heating function upon mounting or wire-bonding the semiconductor chip.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/770,706Filed 3 Feb 2004 · division

Priority

JP P. 2001-19539627 Jun 2001

Published

US 2004/0154742 A112 Aug 2004

Granted

27 Jun 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification22 codes

B23K 20/002
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating: specially adapted…
H10W 46/00
Marks applied to devices
H10P 72/7438
Using temporarily an auxiliary support: with parts of the auxiliary support remaining in the finished device
H10W 72/0198
Manufacture or treatment: batch processes

Recognition device, bonding device, and method of manufacturing a circuit device

Life of this patent

Recognition device, bonding device, and method of manufacturing a circuit device

Life of this patent

Abstract

Claims10