Method for plating of printed circuit board strip

A method of making a plurality of printed circuit board units (PCB units), comprising:

• forming the PCB strip with a component layer, a solder layer and an inner layer with drill holes;
• depositing a component circuit pattern on said component layer;
• depositing a solder circuit pattern on said solder layer;
• depositing an inner layer circuit pattern on said inner layer,
• wherein, said each component, solder and inner layer circuit patterns being shaped to define a plurality of adjacent superimposed PCB units on each layer, said PCB units being separated by imaginary lines and with an electronic component being mounted on each PCB unit on said component layer said component circuit pattern including bond fingers adapted to contact said electronic components;
• said solder circuit pattern including solder ball parts, solder component-clad pads and solder conductive via lands;
• said inner circuit pattern including inner conductor via lands formed around said drill holes;
• said component circuit pattern being formed with component sub-plating lines between said bond fingers of adjacent PCB units;
• said solder circuit pattern being formed with solder sub-plating lines between-said solder ball parts of adjacent PCB units;
• and
• said inner circuit pattern being formed with inner sub-plating lines between said conductive via lands of adjacent PCB units, wherein, said imaginary lines defined within upper and lower limited lines of the sub plating lines in layers;
• connecting the sub-plating line to the copper-clad parts at an outermost board of each PCB unit;
• and
• plating the solder ball parts of the solder circuit pattern and the bond finger part of the component side through the sub-plating line and the copper-clad parts including the conductive via lands;
• and
• cutting said PCB strip along the imaginary lines to separate said PCB units.