Method and apparatus for interconnecting a laser array and an integrated circuit of a laser-based transmitter

A laser-based apparatus comprising:

• a first laser;
• an integrated circuit adapted to drive the first laser;
• a thermally-insulative substrate sandwiched between the first laser and the integrated circuit with the first laser and the integrated circuit arranged directly opposite one another relative to the thermally-insulative substrate the thermally-insulative substrate comprising:
• a first side having a first electrical conductor associated therewith and electrically coupled to the first laser;
• a second side having a second electrical conductor associated therewith and electrically coupled to the integrated circuit, each of said first electrical conductor and said second electrical conductor including a respective electrically-conductive trace;
• and
• an electrically-conductive via passing between the first side and the second side, the electrically-conductive via being electrically coupled to the first electrical conductor and to the second electrical conductor;
• and
• a respective under-fill layer between said thermally-insulative substrate and said integrated circuit and said thermally-insulative substrate and said first laser;
• wherein said first electrical conductor and said second electrical conductor each further includes a respective bond pad for electrically coupling said integrated circuit and said first laser to said respective electrically-conductive trace through said respective under-fill layer.

A method for producing a laser-based device, the method comprising:

• providing a thermally-insulative substrate, the thermally-insulative substrate comprising:
• a first side having at least one first electrical conductor associated therewith;
• a second side having at least one second electrical conductor associated therewith, each of said first electrical conductor and said second electrical conductor including a respective electrically-conductive trace;
• and
• at least one electrically-conductive via passing between the first side and the second side, the electrically-conductive via electrically coupling the first electrical conductor with the second electrical conductor;
• electrically coupling an integrated circuit to the at least one first electrical conductor;
• electrically coupling at least one laser to the at least one second electrical conductor;
• providing a respective under-fill layer between said thermally-insulative substrate and said integrated circuit and said thermally-insulative substrate and said at least one laser, including providing one of the under-fill layers in contact against both the thermally-insulative substrate and the integrated circuit;
• and
• electrically coupling the integrated circuit and the at least one laser to the respective electrically-conductive trace through the respective under-fill layer.